Rumors regarding Samsung's upcoming flagship, Galaxy S9 are already surfacing on the net. According to the Korean media, the device is expected to come with a new type of motherboard, based on the SLP (Substrate like PCB) technology. SLP allows manufacturers to fit more components onto a single board by lowering their footprint and allowing for additional layers of components while retaining the size of the board.

Supposedly, this technology is being followed so that Samsung can fit a bigger battery in the next upcoming Galaxy S flagship without making the handset heavier. The Korean media ETNews claims that this new technology would only be used for the units equipped with the Exynos chipset since the Qualcomm versions will still employ the less-efficient HDI (High-Density Interconnect) technology.

Samsung is also expected to bring an in-display fingerprint sensor on the Galaxy S8 but will not likely come to fruition. A KGI report suggests that this feature is unlikely to come on the Galaxy Note 8 but the upcoming Galaxy S9 could see this feature, BGR reported.

Since OLED iPhone has canceled under-display fingerprint recognition/touch ID functions and earlier reports have also claimed that Apple has extended its plans for the in-display sensor to next year, the Galaxy S9 is now expected to be having the new selling points of upgraded iris recognition and dual camera, Samsung has no risk adopting under-display optical fingerprint solution in a hurry.

Considering Samsung's release cycle, the Galaxy Note 9 is expected to launch in the second half of next year. As of now, this is the only information available, however, it is still over a year away from the flagship's launch so more leaks are expected to come before its release. On the other hand, Samsung is also expected to launch the Galaxy Note 8 this month at the Galaxy Unpacked event.